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product structure silicon monolithic integrated circuit. this product has no designed protec tion against radioactive rays. 1/30 tsz02201-0j3j0aj00390-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 datashee t 14.may.2014 rev.003 7.0v to 36v input, 1.0 a integrated mosfet single synchronous buck dc/dc converter bd9e101fj-lb general description this is the product guarantees long time support in industrial market. bd9e101fj-lb is a synchronous buck switching regulator with built-in power mosfets. it is capable of an output current of up to 1.0a. it is a current mode control dc/dc converter and features high -speed transient response. phase compensation can also be set easily. features ? long time support product for industrial applications. ? synchronous single dc/dc converter. ? over-current protection. ? short circuit protection. ? thermal shutdown protection. ? undervoltage lockout protection. ? soft start. ? sop-j8 package. applications ? industrial equipment. ? power supply for fas industrial device using 24v bass. ? consumer applications such as home appliance. distribution type power supply system for 12v, and 24v. key specifications ? input voltage range: 7.0v to 36v ? output voltage range: 1.0v to v in 0.7v ? output current: 1.0a (max) ? switching frequency: 570khz (typ) ? high-side mosfet on-resistance: 300m ? (typ) ? low-side mosfet on-resistance: 300m ? (typ) ? standby current: 0 a (typ) package w (typ) x d (typ) x h (max) sop-j8 4.90mm x 6.00mm x 1.65mm typical application circuit 2 3 6 4 7 5 1 8 vin 24v enable vinen comp agnd pgnd fb sw boot 10 f 30k 4700pf 12k 3k 0.1 f 10 h 22 f2 bd9e101fj-lb vout figure 1. application circuit sop-j8 downloaded from: http:///
2/ 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 pin configuration pin description(s) pin no pin name de scription 1 boot connect a bootstrap capacitor of 0.1f between this terminal and sw terminal. the voltage of this capacitor is the gate drive voltage of the high-side mosfet. 2 vin power supply terminal for the switching regulator and control circuit. connecting a 10f ceramic capacitor is recommended. 3 en turning this terminal signal l ow -level (0.8v or lower) forces the device to enter the shut down mode. turning this terminal signal high-level (2.5v or higher) enables the device. this terminal must be terminated. 4 agnd ground terminal for the control circuit. 5 fb inverting input node for the gm error amplifier. see page 22 on how to calculate the resistance of the output voltage setting. 6 comp input terminal for the gm error amplifier output and the output switch current comparator. connect a frequency phase compensation component to this terminal. see page 23 on how to calculate the resistance and capacitance for phase compensation. 7 pgnd ground terminal for the output stage of the switching regulator. 8 sw switch node. th is terminal is connected to the source of the high-side mosfet and drain of the l ow -s ide mosfet. connect a bootstrap capacitor of 0.1f between th is terminal and boot terminal. in addition, connect an inductor considering the direct current superimposition characteristic. figure 2. pin assignment sw pgnd fb boot v in en agnd comp 7 8 6 5 3 4 2 1 (top view) downloaded from: http:///
3/ 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 block diagram figure 3 . block diagram 3 vreg3 osc tsd uvlo slope pwm err en 5 fb 6 comp soft start r s 2 vin 7 pgnd 8 sw 4 agnd vout bootreg 1 boot vreg driver logic vin ovp scp ocp 3v 5v rcp downloaded from: http:///
4/ 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 description of block ? vre g3 block creating internal reference voltage 3v (typ). ? vreg block creating internal reference voltage 5v (typ) . ? boot re g block creating gate drive voltage. ? tsd this is the thermal shutdown block. thermal shutdown circuit shuts down the whole system if temp erature exceeds 175c (typ). when the temperature decreases, it returns to normal operation with hysteresis of 25c (typ). ? uvlo this is the under voltage lock-out block. ic shuts down w hen vin is under 6.4v (typ) . the threshold voltage has a hysteresis of 200mv (typ ). ? err this circuit compares the feedback voltage at the output to the reference voltage. the output of this circuit is the comp terminal voltage and this determines the switching duty. also, because of soft start during start- up , comp terminal voltage is controlled by internal slope voltage. ? osc block generating oscillation frequency. ? slope this circuit creates a triangular wave from generated clock in osc. the voltage converted from current sense signal of high side mosfet and the triangular wave is sent to pwm comparator. ? pwm this block determines the switchin g duty by comparing the output comp terminal voltage of error amplifier and output of slope block . ? driver l ogic this is the dc/dc driver block. input to this block is signal from pwm and output drives the mosfets . ? soft start this circuit prevents the overshoot of output voltage and in-rush current by forcing the output voltage to rise slowly, thus, avoiding surges in current during start- up . ? ocp this block limits the current flowing in high side mosfet for each cycle of switching frequency during over-current. ? r cp this block limits the current flowing in low side mosfet for each cycle of switching frequency during over-current. ? scp the short circuit protection block compares the fb terminal voltage with the internal standard voltage vref. when the fb terminal voltage has fallen below 0.85 v (typ) and remained in that state for 1.0msec (typ), scp activates and stops the operation for 16msec (typ) and subsequently initiates a restart. ? ovp over voltage protection function (ovp) compares fb terminal voltage with the internal standard voltage vref. when the fb terminal voltage exceeds 1. 30 v (typ), it turns output mosfets off. when output voltage drops until it reaches the hysteresis, it will return to normal operation. downloaded from: http:///
5/ 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 absolute maximum ratings (ta = 25c) parameter symbol rating unit supply voltage v in -0.3 to +40 v en input voltage v en -0.3 to +40 v voltage from gnd to boot v boot -0.3 to +45 v voltage from sw to boot S v boot -0.3 to +7 v fb input voltage v fb -0.3 to +7 v comp input voltage v comp -0.3 to +7 v sw input voltage v sw - 0. 5 to vin + 0.3 v allowable power dissipation pd 0.67 (note 1) w operating junction temperature range tj - 40 to +150 ? c storage temperature range tstg - 55 to + 150 ? c (note 1) derating in done 5.36 mw/c for operating above ta R 25 c (mount on 1-layer 70.0mm x 70.0mm x 1.6mm board) ca ution1: operating the ic over the absolute maximum ratings may damage the ic. the damage can e ither be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit prot ection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. caution2: reliability is decreased at junction temperature greater than 125 ? c. recommended operating conditions parameter symbol rating unit min typ ma x supply voltage v in 7 .0 - 36 v output current i out 0 - 1.0 a output voltage range v range 1.0 (note 2) - v in 0.7 v (note 2) please use it in i/o voltage setting of which output pulse width does not become 150nsec (typ) or less. see the p age 22 for how to calculate the resistance of the output voltage setting. electrical characteristics (unless otherwise specified v in = 24 v v en =3v ta=25c) parameter symbol limit unit conditions min typ max supply current in operating i opr - 1.5 2. 5 ma v fb = 1.1v no switching supply current in standby i stby - 0 10 a v en = 0v reference voltage v fb 0.98 1.00 1.02 v fb input curre nt i fb -1 0 1 a v fb = 0v switching frequency f osc 484 570 656 k hz maximum duty ratio m axduty 85 90 95 % high -side fet on-resistance r onh - 300 - m i sw = 100ma low-side fet on-resistance r onl - 300 - m i sw = 100ma over current limit i limit - 3.0 - a uvlo detection voltage v uvlo 6.1 6.4 6.7 v v in falling uvlo hysteresis voltage v uvlohys 100 200 300 mv en high-level input voltage v en h 2. 5 - v in v en low-level input voltage v enl - - 0.8 v en input current i en 2.1 4.2 8.4 a v en = 3v soft start time t ss 1. 5 3.0 6.0 ms ec en rising to fb=0.85v v fb : fb input voltage. v en : en input voltage. pd should not be exceeded. downloaded from: http:///
6/ 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 typical performance curves 0.0 0.2 0.4 0.6 0.8 1.0 -40 -20 0 20 40 60 80 100 120 temperature[c] standby current [a] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 80 100 120 temperature[c] operating current[ma] v in =7v v in =36v v in =24v v in =7v v in =24v v in =12v 0.98 0.99 1.00 1.01 1.02 -40 -20 0 20 40 60 80 100 120 temperature[ ] voltage reference[v] v in =36v -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 -40 -20 0 20 40 60 80 100 120 temperature[ ] fb input current[a] v in =24v v in =12v v in =36v v in =24v v in =7v v in =12v figure 4. operating current vs junction temperature figure 5. stand- by current vs junction temperature figure 6. fb voltage reference vs junction temperature figure 7. fb input current vs junction temperature downloaded from: http:///
7/ 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 typical performance curves - continued 485 502 519 536 553 570 587 604 621 638 655 -40 -20 0 20 40 60 80 100 120 temperature[c] switching frequency[khz] 150 200 250 300 350 400 450 -40 -20 0 20 40 60 80 100 120 temperature[c] high side mosfet on resistance[m] 150 200 250 300 350 400 450 -40 -20 0 20 40 60 80 100 120 temperature[c] low side mosfet on resistance[m] v in =12v v in =7v v in =24v 85 86 87 88 89 90 91 92 93 94 95 -40 -20 0 20 40 60 80 100 120 temperature[c] maximum duty[%] v in =7v v in =36v v in =24v v in =24v v in =24v v in =36v v in =12v figure 8. switching frequency vs junction temperature figure 9. maximum duty vs junction temperature figure 10. high side mosfet on - resistance vs junction temperature figure 11. low side mosfet on -resistance vs junction temperature downloaded from: http:///
8/ 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 typical performance curves - continued 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 -40 -20 0 20 40 60 80 100 120 temperature[c] ven input voltage[v] 100 125 150 175 200 225 250 275 300 -40 -20 0 20 40 60 80 100 120 temperature[c] uvlo hysteresis[mv] en sweep up en sweep down figure 12. current limit vs input voltage figure 13. uvlo threshold vs junction temperature figure 14. uvlo hysteresis vs junction temperature figure 15. en threshold vs junction temperature 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 6 9 12 15 18 21 24 27 30 33 36 input voltage[v] current limit[a] t j =- 40 c t j =150c v out =5v 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 -40 -20 0 20 40 60 80 100 120 temperature[ ] vin input voltage[v] v in sweep down v in sweep up t j =25c downloaded from: http:///
9/ 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 typical performance curves - continued 1.0 2.0 3.0 4.0 5.0 -40 -20 0 20 40 60 80 100 120 temperature[c] soft start time[ms] 2.0 3.0 4.0 5.0 6.0 7.0 8.0 -40 -20 0 20 40 60 80 100 120 temperature[c] en input current[a] en=3v v in =24v v in =12v v in =36v v in =7v figure 16. en input current vs junction temperature figure 17. soft start time vs junction temperature downloaded from: http:///
10 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 typical performance curves - continued figure 18. efficiency vs output curre nt (v out = 3.3v, l=10 h) figure 19. efficiency vs output current (v out = 3.3v, l=10 h) figure 20. efficiency vs output current (v out = 12v, l=10 h) 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 output current[a] efficiency[%] 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 output current[a] efficiency[%] en = 3v v out = 3.3v v in = 1 8v v in = 7v en = 3v v out = 5.0v v in = 12v v in = 12v v in = 24v v in = 24v 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 output current[a] efficiency[%] en = 3v v out = 12v v in = 18v v in = 24v v in = 36v downloaded from: http:///
11 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 typical performance curves - continued v in =10v/div en=10v/div v out =2v/div sw=10v/div v in =10v/div en=10v/div v out =2v/div sw=10v/div time=1ms/div time=1ms/div figure 21. power up (v in = en) (v out = 5.0v) figure 22. power down (v in = en) (v out = 5.0v) figure 23. power up (en = 0v 5v) (v out = 5 .0v) figure 24. power down (en = 5v 0v) (v out = 5.0v) v in =10v/div en=2v/div v out =2v/div sw=10v/div v in =10v/div en=2v/div v out =2v/div sw=10v/div time=1ms/div time=1ms/div downloaded from: http:///
12 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 typical performance curves - continued figure 25. v out ripple (v in = 24v, v out = 5v, i out = 0a) figure 26. v out ripple (v in = 24v, v out = 5v, i out = 1.0a) figure 27. v in ripple (v in = 24v, v out = 5v, i out = 0a) figure 28. v in ripple (v in = 24v, v out = 5v, i out = 1.0a) v out =20mv/div sw=10v/div time=1 s/div v out =20mv/div sw=10v/div time=1 s/div v in =50mv/div sw=10v/div time=1 s/div v in =50mv/div sw=10v/div time=1 s/div downloaded from: http:///
13 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 typical performance curves - continued figure 29. switching waveform (v in = 12v, v out = 5v, i out = 1.0a) figure 30. switching waveform (v in = 24v, v out = 5v, i out = 1.0a) i l =500ma/div sw=5v/div i l =500ma/div sw=5v/div time=1 s/div time=1 s/div downloaded from: http:///
14 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 typical performance curves - continued -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 14 16 18 20 22 24 26 28 30 32 34 36 vin input voltage[v] output voltage change[%] figure 31. v out line regulation figure 32. v out line regulation figure 33. v out line regulation v out = 12v -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 6 8 10 12 14 16 18 20 22 24 26 vin input voltage[v] output voltage change[%] -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 6 9 12 15 18 21 24 27 30 33 36 vin input voltage[v] output voltage change[%] v out = 3.3v v out = 5.0v i out =0a i out =1.0a i out =0a i out =1.0a i out =0a i out =1.0a downloaded from: http:///
15 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 typical performance curves - continued figure 34. v out load regulation figure 35. v out load regulation figure 36. v out load regulation -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 output current[a] output voltage change[%] -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 output current[a] output voltage change[%] v in = 18v v out = 3.3v v in = 24v v out = 5.0v -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 output current[a] output voltage change[%] v in = 24v v out = 12v downloaded from: http:///
16 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 typical performance curves C continued figure 39. load transient response i out = 0a C 1.0a (v in = 12 v, v out =3.3v, c out =ceramic22 f 2) f figure 40. load transient response i out =0a C 1.0a (v in = 24 v, v out =5.0v, c out =ceramic22 f 2) figure 37. loop response (v in =12v, v out =3.3v, i out = 1.0a , c out =ceramic22 f 2) figure 38. loop response (v in =24v, v out =5v, i out =1.0a, c out =ceramic22 f 2) -80 -60 -40 -20 0 20 40 60 80 100 1k 10k 100k 1m frequency[hz] gain[db] -180 -135 -90 -45 0 45 90 135 180 phase[deg] phase gain -80 -60 -40 -20 0 20 40 60 80 100 1k 10k 100k 1m frequency[hz] gain[db] -180 -135 -90 -45 0 45 90 135 180 phase[deg] phase gain v in =24v v out =3.3v v in =24v v out =5v v out =100mv/div time=1ms/div i out =500ma/div v out =100mv/div time=1ms/div i out =500ma/div downloaded from: http:///
17 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 function description 1. enable control the ic shutdown can be controlled by the voltage applied to the en terminal. when en voltage reaches 2.5v (t yp), the internal circuit is activated and the ic starts up. setting the shutdown interval (low level interval) of en to 100s or longer will enable the shutdown control with the en terminal. figure 41 . timing chart with enable control 2. protective functions the protective circuits are intended for the prevention of damages caused by unexpected accidents. d o not use them for continuous protective operation. (1) short circuit protection (scp) the short circuit protection block compares the fb terminal voltage with the internal reference voltage vref. w hen the fb terminal voltage has fallen below 0.85 v (typ) and remained in that state for 1.0msec (typ), scp activates and stops the operation for 16msec (typ) and subsequently initiates a restart. table 1. short circuit protection function en pin fb pin short circuit protection switching frequency 2. 5v or higher 0.30v (typ) R fb enabled 142.5khz (typ) 0.30v (typ) b R 0.85 v (typ) 285khz (typ) fb 0.85 v (typ) 570khz (typ) 0.8v or lower - disabled off figure 42. short circuit protection (scp) timing chart 1.0v scp threshold voltage 0.85 (typ.) scp detection time 1.0msec (typ.) scp detection released low ocpthreshold v out fb terminal lower mosfet gate upper mosfet gate ic internal scp signal inductor current soft start 3.0msec (typ.) scp reset scp detection time 1.0msec (typ.) low 16msec (typ.) v en 0 v out 0 t ss v enh v enl en terminal output voltage tt v out 0.85 downloaded from: http:///
18 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 (2) under voltage lockout protection (uvlo) the under voltage lockout protection circuit monitors the vin terminal voltage. the operation enters standby when the vin terminal voltage is 6.4v (typ) or lower. the operation starts when the vin terminal voltage is 6.6v (typ) or higher. figure 43. uvlo timing chart (3) thermal shutdown (tsd) when the chip temperature exceeds tj = 175 ? c, the dc/dc converter output is stopped. the thermal shutdown circuit is intended for shutting down the ic from thermal runaway in an abnormal state with the temperatu re exceeding tjmax = 150 ? c. it is not meant to protect or guarantee the soundness of the application. do not use the function of this circuit for application protection design. (4) over current protection (ocp) the over-current protection function is realized by using the current mode control to limit the current that flows through the h igh -side mosfet at each cycle of the switching frequency. ( 5) reverse current protection (rcp) the reverse current protection function is realized by using the current mode control to limit the current that flows through the low-side mosfet at each cycle of the switching frequency. (6) over voltage protection (ovp) over voltage protection function (ovp) compares fb terminal voltage with internal standard voltage vref. w hen the fb terminal voltage exceeds 1.30 v (typ), it turns output mosfets off . when output voltage drops until it reaches the hysteresis, it will return to normal operation. v in 0vv out high-side mosfet gate fb terminal soft start hys uvlo off uvlo on normal operation normal operation uvlo low-side mosfet gate downloaded from: http:///
19 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 application example figure 44. application circuit table 2. recommendation component valves v in 12 v 24v v out 3.3v 5v c in 10 f 10 f 10 f 10 f 10 f 10 f c boot 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f l 6.8 h 6.8 h 6.8 h 10 h 10 h 10 h r1 6.8 k 6.8 k 6.8 k 12 k 12 k 12 k r2 3.0 k 3 .0 k 3.0 k 3.0 k 3.0 k 3.0 k r3 24 k 24 k 24 k 30 k 30 k 30 k c1 - - - - - - c2 6800pf 6800pf 6800pf 47 00pf 4700pf 4700 pf c out ceramic 22 f 2 ceramic 10 f 3 ceramic 10 f and aluminum 100 f ceramic 22 f 2 ceramic 10 f3 ceramic 10 f and aluminum 100 f boot v in en agnd sw pgndcomp fb v out bd9e101fj-lb v in c in c boot 1 2 3 4 7 6 5 8 c2 c1 c out r1 r2 r3 l downloaded from: http:///
20 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 selection of components externally connected 1 . output lc filter the dc/dc converter requires an lc filter for smoothing the output voltage in order to supply a continuous current to the load. selecting an inductor with a large inductance causes the rip ple current ?il that flows into the inductor to be small, decreasing the ripple voltage generated in the output voltage, but it is not advantageous in terms of the load transient response characteristic. selecting an inductor with a small inductance improves the transient response characteristic but causes the inductor ripple current to be large, which increases the ripple voltage in the output voltage, sho wing a trade-off relationship. here, select an inductance so that the size of the ripple current component of the inductor will be 20% to 50% of the average output current (average inductor current). figure 45. waveform of current through inductor figure 46 . output lc filter circuit computation with v in = 24v, v out = 5v, l = 10 h, switching frequency f osc = 570khz, the method is as below. inductor ripple current voltage output the is voltage input the is inductor the is frequency swithing the is current ripple inductor the is : where [ma] out in osc l osc in out in out l v v l f i 694 = ) v- (v v = i l f v 1 also for saturation current of inductor, select the one with larger current than maximum output current added by 1/2 of inductor ripple current ? i l . output capacitor c out affects output ripple voltage characteristics. select output capacitor c out so that necessary ripple voltage characteristics are satisfied. output ripple voltage can be expressed in the following method. capacitor output the is resistance series equivalent serial the is voltage ripple output the is : where [v] out esr rpl osc out esr l rpl c r v r i v ) + ( = f c8 1 with c out = 44 f, r esr = 10m the output ripple voltage is calculated as i l inductor saturation current > i outmax + S i l /2 i outmax average inductor current S i l vout l c out vin driver downloaded from: http:///
21 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 [mv] 10.3 = ) 570k 44 8 1 + (10m 0.69 = v rpl * when selecting the value of the output capacitor c out , please note that the value of capacitor c load will add up to the value of c out to be connected to v ou t . charging current to flow through the c load , c out and the ic startup, must be completed within the soft-start time this charge . over-current protection circuit operates when charging is continued beyond the soft-start time , the ic may not start . please consider in the calculation the condition that the lower maximum value capacitor c load that can be connected to v out (max) is other than c out . in ductor ripple current maximum value of start- up ( il start ) can be expressed in the following method. il start = output maximum load current(i omax ) + charging current to the output capacitor (i cap ) + S i l [mv] 2 charging current to the output capacitor (i cap ) can be expressed in the following method. time start soft the is e capacitanc load output the is e capacitanc output the is : where [a] ss load out ss out load out cap t c c t v ) c + (c = i from the above equation, v in = 24v, v out = 5v, l = 10 h , i omax = 1.0a (max), switching frequency f osc = 484khz (min), the output capacitor c out = 44f, t ss = 1.5ms soft-start time (min), it becomes the following equation when calculating the maximum output load capacitance c load (max) that can be connected to v out . 73 = c- v t /2) i - i- (1.8 < (max) c out out ss l omax load [ f] inductor ripple current maximum value of start- up ( il start ) < over current protection threshold 1.8 [a](min) downloaded from: http:///
22 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 2 . output voltage s et point the output voltage value can be set by the feedback resistance ratio. [v] 1.0 r r + r = v 2 2 1 out minimum pulse range that can be produced at the output stably through all the load area is 150nsec for bd9e101 fj - lb . use input/output condition which satisfies the following method. osc in out f v v 150(nsec) figure 47 . feedback resisto r circuit 3. input voltage start- up figure 48 . input voltage start- up time soft-start function is designed for the ic so that the output voltage will start according to the time it was decided internally . after uvlo release, the output voltage range will be less than 70% of the input voltage at soft-start operation . please be sure that the input voltage of the soft-start after startup is as follows. [v] 0.7 0.85 v v out in tss v out 0.85 v out uvlo release 6.6vtyp.) v in v in R v out 0.85 0.7 err v o ut r1 r2 1.0v fb downloaded from: http:///
23 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 4. phase compensation a current mode control buck dc /dc converter is a two-pole, one-zero system. the two poles are formed by an error amplifier and load and the one zero point is added by the phase compensation. the phase compensation resistor r cmp determines the crossover frequency f crs where the total loop gain of the dc/dc converter is 0 db. the high value of this crossover frequency f crs provides a good load transient response characteristic but inferior stability. conversely, specifying a low value for the crossover frequency f crs greatly stabilizes the characteristics but the load transient response characteristic is impaired. (1) selection of phase compensation resistor r cmp the phase compensation resistance r cmp can be determined by using the following equation. (typ)) a/v (150 ctance transcondu amplifier error the is (typ)) a/v (7 gain sense current the is (typ)) v (1.0 voltage reference feedback the is e capacitanc output the is the is voltage output the is : where ][ frequency crossover ma mp fb out crs out ma mp fb out crs out cmp g g v c f v g g v c f v 2 = r ( 2) selection of phase compensation capacitance c cmp for stable operation of the dc/dc converter, inserting a zero point under 1/6 of the zero crossover frequency cancels the phase delay due to the pole formed by the load often, thus, provid ing favorable characteristics. the phase compensation capacitance c cmp can be determined by using the following equation. inserted point zero the is where [f] z z cmp cmp f f r 2 1 = c ( 3) loop stability to ensure the stability of the dc/dc converter, make sure that a sufficient phase margin is provided. phase margin of at least 45 degrees in the worst conditions is recommended. the feed forward capacitor c rup is used for the purpose of forming a zero point together with the resistor r up to increase the phase margin within the limited frequency range. using a c rup is effective when the r up resistance is larger than the combined parallel resistance of r up and r dw . figure 49 . phase compensation circuit figure 50 . bode p lot phase margin 180 90 180 90 0 0 a (a) gbw(b) f f gain [db] db phase phase[deg] f crs v out r up fb comp 1.0v r dw c rup r cmp c cmp downloaded from: http:///
24 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 pcb layout design in buck dc/dc converters, a large pulsed current flows in two loops. the first loop is the one into which the current flows when the high side fet is turned on . the flow starts from the input capacitor c in , runs through the fet, inductor l and output capacitor c out and back to ground of c in via ground of c out . the second loop is the one into which the current flows when the low side fet is turned on. the flow starts from the low side fet, runs through the inductor l and output capacitor c out and back to ground of the low side fet via ground of c out . tracing these two loops as thick and short as possible allows noise to be reduced for improved efficiency. it is recommended to connect the input and output capacitors, in particular, to the ground plane. the pcb layout has a great influence on the dc/dc converter in terms of all of the heat generation, noise and efficiency characteristics. accordingly, design the pcb layout with particular attention paid to the following points. ? provide the input capacitor as close to the vin terminal as possible on the same plane as the ic. ? if there is any unused area on the pcb, provide a copper foil plane for the ground node to assist in heat dissipation from the ic and the surrounding components. ? switching nodes such as sw are susceptible to noise due to ac coupling with other nodes. trace to the inductor as thick and as short as possible. ? provide lines connected to fb and comp as far as possible from the sw node. ? provide the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. figure 51. current loop of buck converter c in mos fet c out v out l v in figure 52. example of sample board layout pattern l c in c out c boot c2 r3 vout sw vin gnd en r1 r2 top layer bottom layer downloaded from: http:///
25 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 power dissipation when designing the pcb layout and peripheral circuitry, sufficient consideration must be given to ensure that the power dissipation is within the allowable dissipation curve. i/o equivalence circuit(s) 1. boot 8. sw 3. en 5. fb 6. comp figure 54 . i/o equivalent ci rcuit chart figure 53. power dissipation (sop-j8) ja =185.2c /w 1 layer board (back side copper foil area:70mm 70mm) power dissipation: pd [w] temperature:ta [c] fb agnd comp vreg agnd agnd agnd bootreg pgnd boot sw reg v in en agnd 280k 294k 146k 0 25 50 75 100 125 150 0 0.4 0.6 0.8 0.67w 0.2 downloaded from: http:///
26 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 operational notes 1. reverse connection of power s upply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of t he digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. al ways discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. t o prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply a nd output pin . inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
27 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 operational notes C continued 11. unused input terminals input pin s of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pin s should be connected to the power supply or ground line. 12. regard ing input p in s of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order t o keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substr ate) should be avoided. figure 55 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit (tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to the ic. normal operation should al ways be within the ics power dissipation ratin g. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls be low th e tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
28 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 ordering information b d 9 e 1 0 1 f j - l b h 2 part number package fj: sop-j8 product class lb: for industrial applications packaging and forming specification h2: embossed tape and 18cm reel (quantity : 250pcs) b d 9 e 1 0 1 f j - l b e 2 part number package fj: sop-j8 product class lb: for industrial applications packaging and forming specification e2: embossed tape and 32.8cm reel (quantity : 2500pcs) marking diagr am s sop-j8 (top view) 9 e 1 0 1 part number marking lot number 1pin mark downloaded from: http:///
29 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 physical dimension, tape and reel information package name sop-j8 downloaded from: http:///
30 / 30 b d9 e1 01 fj - lb tsz02201- 0j 3j0aj00 39 0-1-2 ? 20 13 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15 ? 001 14.may.2014 rev.003 revision history date draft changes 01 . nov .2013 001 new release 21.feb.2014 002 delete sentence and log life cycle in general description and futures. change packaging and forming specification from e2 to h2. 14.may.2014 003 add e2 rank of packaging and forming specification downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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